I guess they consider that a solved problem: when you can drop arbitrary connections without meaningful heating of stuff outside of the connection, just glue your SMD parts wherever you consider convenient and fuse lines to its connection pads.

But practical application would likely stick to more or less conventional boards (tiny ones for sure) and use those ink lines only for where it's needed. Unless perhaps there's an application where crossing over with simple fused layer printing allows something revolutionary from going 3D? But 2D boards are really, really cheap and multiple layers are already giving ever conceivable advantage 3D could give, outside of stuff like antenna geometries.

For one-off and prototyping, an integrated fused layer + pick&place + circuit fuser machine could be super attractive of course: basically bridging the gap between breadboard and production quality. But I really doubt that this device would be anywhere near hobby workshop tinkering range...