Reflowing smd paste inside print won't work reliably as the solder will tend to form blobs instead of keeping the track shape
Reflowing smd paste inside print won't work reliably as the solder will tend to form blobs instead of keeping the track shape
I actually tried mixing in fine copper dust with fine SAC305 paste to create a non-liquid amalgam on re-flow, but the void/inclusion problem was worse than conventional SLS processes.
Also looked at RF and metal salt processes, but it had more problems/hazardous-material than traditional laser setups.
The core problem is making these machines safe and cheap to use. =3