There is no single answer. It depends on the exact components, their sensitivities, frequencies and energies used, and how much failure risk are you willing to take.

Rule of thumb: one simple xtal per board in small manufacturing runs (4 digits or less) means you're fine.

The larger your manufacturing runs are, and the more sensitive components you have on your boards, the more careful you want to be. Components can easily make the difference between 0.2% failure rate and 2% failure rate, and that 2% failure rate bites when you push units by hundreds of thousands.

Of course, there's always a chance of you getting a perfect match of the exact intensity and frequency used on a given manufacturing line, which you didn't know, with what happens to kill your specific components at a disproportionate rate, which you also didn't know. But it's a pretty low chance. Feeling lucky?

Because yes, it's not actually worth the engineering/support effort for you, your manufacturer and your part vendor to actually put the thinking cap on and characterize all of that shit for a typical low volume run. So luck it is.