If it's QFN, you're probably best deadbugging it and jumpering all of the pins individually, but first make sure that you need the connection. QFP wireframes all have a center pad, whether or not it's electrically connected to the die or needed for thermal dissipation.
If it's an SO package, e.g. SSOP, TSOP, etc., Desolder the IC, add the jumper wire, bend the pins down enough to account for the thickness of the jumper wire, and resolder the IC.
Either way, make sure you have enough thermal mass connected to it for thermal dissipation. If there's components on the opposite side of the PCB, it's probably not much.
If it's QFN, you're probably best deadbugging it and jumpering all of the pins individually, but first make sure that you need the connection. QFP wireframes all have a center pad, whether or not it's electrically connected to the die or needed for thermal dissipation.
If it's an SO package, e.g. SSOP, TSOP, etc., Desolder the IC, add the jumper wire, bend the pins down enough to account for the thickness of the jumper wire, and resolder the IC.
Either way, make sure you have enough thermal mass connected to it for thermal dissipation. If there's components on the opposite side of the PCB, it's probably not much.
Isn't it just ground? If not, can you drill a corner of the chip? Most of chip material is just plastic.