That kingston ram is DDR5-5600, with smaller memory sizes, and has a longer warranty. This suggests that the product is binned memory from a line that is relatively mature (and by extension low failure rates).
And, because it's clocked lower, it runs cooler, which reduces failure rate.
On top of that, server memory is usually binned more strictly. And, it usually has bits missing for ECC, custom controller firmware, and cutting edge processes for packing more memory into the form factor.
Now as a consumer you may think an LED is "riced" out, but I think custom firmware on your ram built for your application is way more "riced".
> None of that stuff actually helps
It probably actually does, especially for "high end" ram. IE stuff running at much higher transfer rates. Heat and voltage are the enemies of stability here. A heat sink/transfer shield is certainly going to help (in theory, anyways)
On top of that, server ram has a higher expectation of cooling quality than consumer, which can be anything goes.
The ricer heatspreaders don’t actually help, sometimes they hurt. If you care about memory performance, you have to direvt airflow properly, and the chips themselves don’t output enough heat to require a heatsink, but they do need the airflow.
Workstations/servers have forced air cooling that drives a significant amount of airflow over the ram sticks. Gaming PCs don't. I don't think you can make the assumption that heat spreaders / sinks on ram don't help in them.
I thought the gaming PC airflow was front fans => cpu cooler => back (and top) exhaust fan(s) which puts the RAM sticks in the smack middle of the airflow.
> which puts the RAM sticks in the smack middle of the airflow
They're usually perpendicular to the air flow. Bonus points for there being a beefy ATX connector in front.
So maybe the first stick gets some air, but all the others are hidden behind it and don't get much. I think that's the theory why many heatsinks on ricing sticks tend to have a comb design.
I also wonder about M.2 drives, mounted flat to the motherboard with what seems like lip-service to cooling. One of my bug-bears with PC design has been as heat/power demands increase it seems like there's a lack of incentive to do more than the bare minimum on coordination to drastically improve layout, the GPU daughterboard growing into a brick you need to mount and cool is another. I don't entirely blame them when shiny lights keep on selling.
> It really gives the game away.
Does it?
That kingston ram is DDR5-5600, with smaller memory sizes, and has a longer warranty. This suggests that the product is binned memory from a line that is relatively mature (and by extension low failure rates).
And, because it's clocked lower, it runs cooler, which reduces failure rate.
On top of that, server memory is usually binned more strictly. And, it usually has bits missing for ECC, custom controller firmware, and cutting edge processes for packing more memory into the form factor.
Now as a consumer you may think an LED is "riced" out, but I think custom firmware on your ram built for your application is way more "riced".
> None of that stuff actually helps
It probably actually does, especially for "high end" ram. IE stuff running at much higher transfer rates. Heat and voltage are the enemies of stability here. A heat sink/transfer shield is certainly going to help (in theory, anyways)
On top of that, server ram has a higher expectation of cooling quality than consumer, which can be anything goes.
The ricer heatspreaders don’t actually help, sometimes they hurt. If you care about memory performance, you have to direvt airflow properly, and the chips themselves don’t output enough heat to require a heatsink, but they do need the airflow.
Workstations/servers have forced air cooling that drives a significant amount of airflow over the ram sticks. Gaming PCs don't. I don't think you can make the assumption that heat spreaders / sinks on ram don't help in them.
I thought the gaming PC airflow was front fans => cpu cooler => back (and top) exhaust fan(s) which puts the RAM sticks in the smack middle of the airflow.
> which puts the RAM sticks in the smack middle of the airflow
They're usually perpendicular to the air flow. Bonus points for there being a beefy ATX connector in front.
So maybe the first stick gets some air, but all the others are hidden behind it and don't get much. I think that's the theory why many heatsinks on ricing sticks tend to have a comb design.
I also wonder about M.2 drives, mounted flat to the motherboard with what seems like lip-service to cooling. One of my bug-bears with PC design has been as heat/power demands increase it seems like there's a lack of incentive to do more than the bare minimum on coordination to drastically improve layout, the GPU daughterboard growing into a brick you need to mount and cool is another. I don't entirely blame them when shiny lights keep on selling.