I mean, there's no real reason a chip has to be a wafer.

A toroidal shape would allow more interconnects to be interspaced throughout the design as well as more heat-transfer points alongside the data transfer interconnects.

Something like chiplet design where each logical section is a complete core or even an SOC with a robust interconnect to the next and previous section.

If that were feasible, you could build it onto a hollow tube structure so that heat could be piped out from all sides once you sandwich the chip in a wraparound cooler.

I guess the idea is more scifi than anything, though. I doubt anyone other than ARM or RISC-V would ever even consider the idea until some other competitor proves the value.