The die was much smaller…

Die size: 135mm²

A current AMD CCD is ~70mm² and can drop around 120 W or so on that area. E.g. the 9700X has one CCD and up to a 142W PPT, 20 W goes to the IOD, ~120 into the CCD.

edit: (1) this account/IP-range is limited to a handful of comments per day so I cannot reply directly, having exhausted my allotment of HN comments for today (2) I do not understand what you take offense at, because I did not "change [my] original argument" - you claimed, a P4 die is much smaller, I gave a counter example, and made the example more specific in response to your comment (by adding the "E.g. ..." bit with an example of a SKU and how the power would approximately split up).

The tdp is for the whole cpu with multiple ccds and iod…

Since Milan the IOD consumes up to 40W during extended PPT loads (The right term for the numbers you are talking about which is more keen to Turbo of the older P4s ie. 130W tdp on Prescott). It's also important that PPT refers to power delivered to the socket, not directly to the CPU, and shouldn't be confused with TDP. Editing comments to change your original argument is cowardly behavior, so I'm ending this discussion.

You added wrong numbers and shifted the metric from tdp to ppt. There seems to be a reason for your restrictions. Goodbye.

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